http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4722961-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24137 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-19 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3512 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-96 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2008-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4722961-B2 |
| titleOfInvention | Method for manufacturing multilayer printed wiring board incorporating semiconductor element |
| priorityDate | 2008-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.