http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4705070-B2

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filingDate 2007-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2011-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-4705070-B2
titleOfInvention Semiconductor device, manufacturing method thereof, and display device manufacturing method,
abstract <P>PROBLEM TO BE SOLVED: To enable electrically connecting a semiconductor element with electrode pitches of 30 &mu;m or less to a circuit board, and to realize high density mounting of the semiconductor device. <P>SOLUTION: Connecting an interposer 1 with its face downward to the circuit board 7, and the semiconductor element 4 with its face downward to the interposer 1, allows semiconductor element 4 to be connected on a semiconductor wiring spacing level, and connection with the circuit board 7 in a conventional pitch to be performed. Furthermore, using a semiconductor substrate incorporating a functional circuit in the interposer, allows a substrate size to be drastically reduced and greatly contributes to the miniaturization of products. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT
priorityDate 2007-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 23.