http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4704828-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate | 2005-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4704828-B2 |
| titleOfInvention | Manufacturing method of pressure-sensitive adhesive sheet for attaching to wafer and IC chip with adhesive layer for die bonding |
| abstract | <P>PROBLEM TO BE SOLVED: To provide an adhesive sheet for sticking a wafer by which an IC chip with an adhesive layer for bonding a die can be easily obtained without breaking the IC chip or causing chipping, and to provide a manufacturing method for the IC chip with the adhesive layer for bonding the die using the sheet. <P>SOLUTION: The adhesive sheet for sticking a wafer is composed of a base material, an adhesive layer which is formed on the base material and includes a gas generation agent for generating gas by a stimulus, and an adhesive layer for bonding a die formed on the adhesive layer. In the adhesive sheet for sticking the wafer, an elastic modulus G' of the adhesive layer for bonding a die at 23°C based on dynamic viscoelasticity measured by a shearing method under conditions of a frequency 10 Hz, a setting distortion of 0.5%, and a temperature rise speed of 3°C/minute is ≥1×10<SP>6</SP>Pa. 180° peel strength between the adhesive layer and the adhesive layer for bonding the die measured by the method based on JIS Z 0237 is 0.02-1 N/25 mm. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2014192631-A1 |
| priorityDate | 2004-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 113.