http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4680493-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-38 |
| filingDate | 2003-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4680493-B2 |
| titleOfInvention | Electroless copper plating solution and electroless copper plating method using the same |
| priorityDate | 2003-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.