| Predicate |
Object |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 |
| filingDate |
2006-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2011-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-4654938-B2 |
| titleOfInvention |
Positive photosensitive resin composition, photosensitive element using the same, positive resist pattern forming method, and printed wiring board manufacturing method |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10108091-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9810984-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10289001-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160087848-A |
| priorityDate |
2005-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |