| abstract |
The present invention provides an adhesive sheet for producing a semiconductor device, a semiconductor device, and a production method for the semiconductor device, wherein the adhesive sheet for manufacturing the semiconductor device can prevent the remains of a bond, while keeping the wire bonding properties of a thermosetting adhesive and the mold flush characteristics when used in manufacturing of a semiconductor device, such as QFN etc., and which can prevent making defective products of the semiconductor device. The adhesive sheet for manufacturing the semiconductor device is releasablyput on a lead frame or wiring substrate of a semiconductor device, and includes a base material and an adhesive layer containing a thermosetting resin component (a1) and a thermoplastic resin component (b1) one of which containing fluorous olefin resin. |