http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4606894-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate | 2005-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4606894-B2 |
| titleOfInvention | Metal pattern forming method, metal pattern, printed wiring board using the same, and TFT wiring circuit |
| abstract | The invention provides a method of forming a metallic pattern including: (a) forming, in a pattern form on a substrate, a polymer layer which contains a polymer that has a functional group that interacts with an electroless plating catalyst or a precursor thereof; (b) imparting the electroless plating catalyst or precursor thereof onto the polymer layer; and (c) forming a metallic film in the pattern form by subjecting the substrate having the polymer layer to electroless plating using an electroless plating solution, wherein the substrate is treated using a solution comprising a surface charge modifier or 1*10<-10> to 1*10<-4> mmol/l of a plating catalyst poison before or during the (c) forming of the metallic film. The invention further provides a metallic pattern obtained thereby. Furthermore, the invention provides a printed wiring board and a TFT wiring board, each of which uses the metallic pattern as a conductive layer. |
| priorityDate | 2005-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 221.