http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4556324-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2000-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2010-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4556324-B2 |
| titleOfInvention | Area mounting semiconductor sealing epoxy resin composition and area mounting semiconductor device. |
| priorityDate | 2000-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.