http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4525139-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2004-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2010-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4525139-B2 |
| titleOfInvention | The manufacturing method of the epoxy resin composition for semiconductor sealing. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109909494-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109909494-B |
| priorityDate | 2004-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 57.