http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4463172-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-04 |
| filingDate | 2005-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2010-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4463172-B2 |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained using the same |
| priorityDate | 2005-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.