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filingDate 2004-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2010-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2010-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-4409990-B2
titleOfInvention A method of manufacturing a solder circuit board.
priorityDate 2003-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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