http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4369582-B2

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filingDate 2000-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2009-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2009-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-4369582-B2
titleOfInvention Semiconductor device and manufacturing method thereof
abstract PROBLEM TO BE SOLVED: To solve a problem that a normal stabilized operation can not be ensured for internally sealed semiconductor elements 3a, 3b over a long term due to cracking on an insulating basic body 1, or stripping or bursting of a sealing resin layer 6. SOLUTION: The semiconductor device comprises a substantially flat square insulation base body 1 having a recess 1b for containing a semiconductor element 3b on one major surface and a plurality of wiring conductors 4 laid from the inside of the recess 1b to the outer circumference of the major surface, the semiconductor element 3b mounted on the bottom of the recess 1b, a plurality of external lead terminals 2 having one end bonded to a part of the wiring conductor 4 led out to the outer circumference of the major surface, and the other end projecting outward from the side of the insulation basic body 1, and a resin 6 for sealing the insulation basic body 1, the semiconductor element 3b, and a part of the external lead terminals 2 wherein the recess 1b has an inclining or stepped side. The inclining or stepped side of the recess 1b distribute and relax stress well thus protecting the insulation basic body 1 against cracking.
priorityDate 2000-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 22.