http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4329233-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2000-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4329233-B2 |
| titleOfInvention | Epoxy resin composition for sealing and semiconductor device |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002037863-A |
| priorityDate | 2000-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.