| Predicate |
Object |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate |
2003-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2009-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2009-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-4288469-B2 |
| titleOfInvention |
Electroless tin plating bath for preventing copper erosion and method for preventing copper erosion |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8261567-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11072706-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10781349-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11041103-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10287471-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10501671-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10428257-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10428256-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10155894-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10312177-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11373921-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10174433-B2 |
| priorityDate |
2003-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |