http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4258011-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 1999-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4258011-B2 |
| titleOfInvention | Electro-copper plating bath and semiconductor device in which copper wiring is formed by the plating bath |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7095867-B2 |
| priorityDate | 1999-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 218.