http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4254216-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92125 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22 |
| filingDate | 2002-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4254216-B2 |
| titleOfInvention | Solder paste and method for assembling semiconductor device using the same |
| priorityDate | 2002-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 55.