| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A45B25-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29D11-00298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A45B19-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67126 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L31-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 |
| filingDate |
2005-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2008-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-4185501-B2 |
| titleOfInvention |
Injection cast molding apparatus for sealing semiconductor elements and method of use |
| priorityDate |
2004-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |