http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4165072-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J167-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-14 |
| filingDate | 2002-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4165072-B2 |
| titleOfInvention | Adhesive composition, adhesive film, wiring board for semiconductor mounting, semiconductor device and manufacturing method thereof |
| abstract | <P>PROBLEM TO BE SOLVED: To provide an adhesive composition capable of being stably stored for a long period and capable of being hardened in a short time, when used in mounting a semiconductor chip on a wiring board, such as a glass-epoxy board and a flexible board, which is called an interposer, and to provide an adhesive film. <P>SOLUTION: This adhesive composition contains 100 pts.wt. of (a) a mixture of (a1) an epoxy resin, (a2) a hardener, and (a3) a latent hardener or a latent hardening accelerator of which the both have surfaces covered with an active group-protecting material, 10-500 pts.wt. of (b) a polymer compound which is soluble in an organic solvent having a SP (solubility parameter) of 8.2-9.0 (cal/cm<SP>3</SP>)<SP>1/2</SP>and has a weight-average molecular weight of 10,000-2,000,000, and 20-30,000 pts.wt. of (c) the organic solvent which has the SP of 8.2-9.0 (cal/m<SP>3</SP>)<SP>1/2</SP>. The adhesive film has a filmlike adhesive layer which is given by forming the adhesive composition into a filmlike material and heating the material to remove the organic solvent. <P>COPYRIGHT: (C)2003,JPO |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101715818-B1 |
| priorityDate | 2002-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 107.