| abstract |
PROBLEM TO BE SOLVED: To provide an electronic circuit device which raises the bonding strength at the time when a defect in the surface of a bonding part is suppressed and an aluminum wire is bonded to the bonding part by a direct wire bonding method, and to provide a method of manufacturing the device. SOLUTION: In an electronic circuit device, a groove 30 is provided between a gate 40 used as a gate at the time of a casting of an aluminum case 10 and a bonding wire 20 for bonding an aluminum wire by a direct wire bonding method. Therefore, at the time of the start of a casting of an aluminum dicasting, splashes of a melted aluminum from the gate are blocked by the dam of a top mold to prevent the splashes from being adhered to a bonding part formation. Consequently, the bonding strength at the time when a defect in the surface of the bonding part 20 is suppressed and the aluminum wire is bonded to the bonding part 20 by the direct wire bonding method can be raised. Moreover, when an insulating board is made to secure on a board mounting surface 11 with a bonding agent or the like, the bonding agent can be prevented from flowing out on the periphery of the mounting surface 11 by the groove 30. |