| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-16 |
| filingDate |
1999-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2008-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-4150466-B2 |
| titleOfInvention |
Semiconductor sealing resin composition, semiconductor device using the same, and method for manufacturing semiconductor device |
| priorityDate |
1998-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |