| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24137
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-96 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2001-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2008-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-4137389-B2 |
| titleOfInvention |
Method for manufacturing multilayer printed wiring board incorporating semiconductor element |
| priorityDate |
2001-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |