http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-3990906-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2001-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-3990906-B2 |
| titleOfInvention | Novel photosensitive resin composition and pattern production method using the same |
| abstract | <P>PROBLEM TO BE SOLVED: To provide a new photosensitive resin composition which is an imide composition not having a polyamic acid structure having a problem in preservation stability, and not essentially requiring water-absorbing hydroxy group and carboxy group in its side chain as its final state, and a method for producing a pattern by using the same. <P>SOLUTION: This polyimide precursor having a polyamide unit in which the polyamide acid sites are esterified is provided. Preferably, the polyimide precursor has the polyimide units and these units may present as mixed in a same molecule. Or the polyamide in which the polyimide acid sites are esterified and a polyimide may be mixed. The polyimide precursor can be made as a positive type photosensitive resin composition by mixing with a photo acid-generating agent and used suitably as the positive type etching resist, etc. <P>COPYRIGHT: (C)2003,JPO |
| priorityDate | 2001-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 321.