http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-3955234-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2002-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-3955234-B2 |
| titleOfInvention | Thermosetting resin composition and semiconductor device using the same |
| abstract | <P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has a function of removing a metal oxide film or an antioxidant film present on the surface of a semiconductor device or a wiring circuit board electrode; and a semiconductor device sealed with the composition. <P>SOLUTION: This thermosetting resin composition contains (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a curing agent, (C) a compound represented by formula (1): R<SP>1</SP>-(COO-CH(CH<SB>3</SB>)-O-R<SP>2</SP>)<SB>n</SB>or formula (2):-(OCO-R<SP>3</SP>-COO-CH(CH<SB>3</SB>)OR<SP>4</SP>-O-CH(CH<SB>3</SB>))<SB>n</SB>-, and (D) a microcapsuled cure accelerator comprising a core section consisting of a cure accelerator and a shell section covering the core section and consisting of a polymer having structure units represented by formula (3): -N(R<SP>5</SP>)-CO-N(R<SP>6</SP>)- and the semiconductor device sealed with the composition is provided. <P>COPYRIGHT: (C)2003,JPO |
| priorityDate | 2001-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 122.