http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-3849637-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3492 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02 |
| filingDate | 2002-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2006-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-3849637-B2 |
| titleOfInvention | Photosensitive resin composition |
| abstract | <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition suitable for a solder resist composition superior in the adhesion of a resist film to copper and the other substrates and wet heat resistance. <P>SOLUTION: The photosensitive resin composition contains a carboxylic photosensitive resin (A), an epoxy hardening agent (B) represented by formula (I) and a photopolymerization initiator (C). In the formula, each of R<SP>1</SP>-R<SP>4</SP>is an H atom or a 1-4C alkyl or 6-18C aryl group and at least one of R<SP>1</SP>-R<SP>4</SP>is a 1-4C alkyl or 6-18C aryl group; each of R<SP>5</SP>and R<SP>6</SP>is an H atom or a 1-2C alkyl group; and n is 0, 1, 2 or 3. <P>COPYRIGHT: (C)2003,JPO |
| priorityDate | 1997-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 222.