http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-3789603-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate | 1997-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2006-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-3789603-B2 |
| titleOfInvention | Thermosetting resin composition for multilayer printed wiring boards |
| priorityDate | 1997-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 106.