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filingDate 1998-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2005-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2005-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-3719857-B2
titleOfInvention Resin paste for semiconductor
abstract PROBLEM TO BE SOLVED: To obtain a resin paste capable of being cured in both an inline curing system and a batch curing system by using a liquid epoxy resin, a phenolic curing agent, a latent curing agent, a silane compound, an organic borate salt and an inorganic filler as the essential components. SOLUTION: The liquid epoxy resin comprises an epoxy resin represented by formula I and an epoxy-containing reactive diluent in a ratio of 70:30 to 100:0 by weight. In formula I, R is a 1-3C alkyl or -H. The silane compound used is represented by formula II (wherein R1 is an epoxy-containing aliphatic or aromatic functional group; R2 is an alkoxyl; and R3 is an alkyl or an alkoxyl). The paste comprises 100 pts.wt. liquid epoxy resin, 20-60 pts.wt. phenolic curing agent, 0.5-5 pts.wt. latent curing agent, 10-60 pts.wt., per 100 pts.wt. total of the three components, organic borate salt, and 0.5-10 pts.wt. inorganic filler.
priorityDate 1998-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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