http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-3649523-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08 |
| filingDate | 1996-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2005-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2005-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-3649523-B2 |
| titleOfInvention | Die bonding material |
| abstract | PROBLEM TO BE SOLVED: To provide a die bonding material reduced in stress and excellent in adhesion, curability, etc. SOLUTION: The material comprises: a reaction product obtained by reacting an epoxy compound (a) represented by the formula with a bisphenol (b) in a molar ratio [proportion of the epoxy groups in the compound (a) to the hydroxyl groups in the compound (b)] of 1-5; a compound having at least two phenolic hydroxyl groups; and an inorganic filler. The content of the reaction product is at least 30wt.% based on the whole epoxy resin. |
| priorityDate | 1996-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.