| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-36 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 |
| filingDate |
2001-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2004-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2004-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-3599101-B2 |
| titleOfInvention |
Solder, surface treatment method of printed wiring board using the same, and mounting method of electronic component using the same |
| priorityDate |
2000-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |