Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-0335 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-91 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-09 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-482 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-00 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8242 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-108 |
filingDate |
1997-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2004-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2004-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-3594213-B2 |
titleOfInvention |
Method of forming connection portion and semiconductor chip |
priorityDate |
1996-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |