http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-3536640-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15747 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate | 1998-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2004-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2004-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-3536640-B2 |
| titleOfInvention | Adhesive film, manufacturing method thereof, support member with adhesive film, and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To obtain a bonding film without fouling a semiconductor element or a heating device due to its ability to withstand a soldering heat treatment and emit only a small amount of an out gas (fume) at the time of packaging. SOLUTION: This bonding film is obtained by mixing a thermoplastic resin with an epoxy resin, a naphthol-based epoxy resin curing agent having >=3 aromatic rings in the molecule in an organic solvent, forming a layer of the resultant mixture liquid on a substrate, heating and drying the formed layer and then removing the substrate. A polyimide resin is preferred as the thermoplastic resin. |
| priorityDate | 1998-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 126.