| abstract |
A method of production of a circuit board able to prevent peeling of a conductive layer during polishing of the conductive layer including the steps of forming at least holes in one surface of a substrate; forming a plating power supply layer on the one surface of the substrate, the other surface, the sides, and inner surfaces of the holes; forming a metal layer formed on the one surface of the substrate, the other surface, and the sides and burying the holes by electroplating through the plating power supply layer; and polishing the metal layer to form interconnect patterns comprised of the metal layer buried in the holes. |