http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-3462282-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 1994-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2003-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2003-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-3462282-B2 |
| titleOfInvention | Resin-sealed semiconductor device, electronic circuit device, and method of manufacturing the same |
| abstract | PURPOSE: To reduce the warping of a substrate by a method wherein a semiconductor element is arranged on a substrate and then sheet-like non-cured resin is arranged thereon and in order to cure-mold resin sheet in a metallic mold, the complex elastic modulus and dynamic tangent loss at the room temperature after the formation of a resin layer is specified. CONSTITUTION: A sealing resin sheet 5 is arranged on a substrate 1 whereon a semiconductor element 3 is packaged using a bonding wire 4. Besides, solder bumps 2 for input-output terminals are quardratically arranged. Next, outside metallic molds 7 are tightened to bury the gap between a package for avoiding the burring. Finally, the inside metallic mold 8 is tightened for curing the resin while pressurizing. At this time, the complex elastic modulus of a resin layer at the room air temperature after the molding step is at most 6.5×10<9> Pa while the dynamic tangent loss is at least 0.05. Through these procedures, the warping of the package substrate can be reduced. |
| priorityDate | 1994-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 92.