http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-3417283-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L91-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1998-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2003-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2003-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-3417283-B2 |
| titleOfInvention | Epoxy resin composition for sealing and semiconductor device sealing method |
| priorityDate | 1998-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.