http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-3410041-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19105 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 |
| filingDate | 1999-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2003-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2003-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-3410041-B2 |
| titleOfInvention | Hybrid module |
| abstract | PROBLEM TO BE SOLVED: To provide a hybrid module having a satisfactory heat radiation property. SOLUTION: This hybrid module 10 is provided with a circuit board 11, where a recessed part 19 is formed and a circuit component 13 mounted inside the recessed part 19 with its facedown and provided with a heat generation property. A heat radiation plate 14 is adhered to the circuit component 13 and arranged at the recessed part 19, and the heat radiation plate 14 is provided with slits 25 for absorbing thermal stress generated on the adhesion surface with the circuit component 13. Since a buffer region for absorbing the thermal stress is formed on the heat radiation plate 14 by the slits 25, the destruction of the adhesion surface due to the thermal stress is prevented. |
| priorityDate | 1999-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.