| Predicate |
Object |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate |
1995-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2002-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-3340882-B2 |
| titleOfInvention |
Epoxy resin composition for encapsulating semiconductor element and resin-encapsulated semiconductor device |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103396652-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103396652-B |
| priorityDate |
1995-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |