| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12556
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12792
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12438 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 |
| filingDate |
1994-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2002-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-3329572-B2 |
| titleOfInvention |
Copper foil for printed circuit and surface treatment method thereof |
| priorityDate |
1994-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |