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filingDate 1996-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2002-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2002-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-3313292-B2
titleOfInvention Die attach paste
abstract PROBLEM TO BE SOLVED: To set low stress, adhesiveness, low water absorbing property and wire bonding property to be satisfactory by including a reaction product obtained by bringing in advance an epoxy resin shown by a specified expression and a cyanate resin having cyanate ester group in a molecule, as an essential component. SOLUTION: The reaction product obtained by previously making epoxy resin shown by the expression respond to cyanate resin having a cyanate ester group in the molecule is set to be the essential component. Epoxy resin, hardner, mineral filler are set top be the essential components. In the expression, R1 and R2 are bivalent aliphatic group whose number of carbons is 1-5 or a bivalent organic group containing an aromatic ring whose number of carbons in not less than six. They can be similar or different. When the epoxy resin is brought into reaction in advance with the cyanate resin having the cyanate ester group in the molecule to make the reaction product to be a polymer, a volatile component can be suppressed.
priorityDate 1996-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 49.