| Predicate |
Object |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-523
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-28 |
| filingDate |
1996-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2002-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-3257426-B2 |
| titleOfInvention |
Epoxy resin molding material for sealing electronic parts and electronic parts |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8159442-B2 |
| priorityDate |
1996-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |