| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate |
1994-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2002-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-3255391-B2 |
| titleOfInvention |
Epoxy resin composition for semiconductor encapsulation |
| priorityDate |
1994-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |