| abstract |
A semiconductor device, comprising: a semiconductor chip; a semiconductor chip attachment element facing the semiconductor chip, at least one interconnect on the surface of the semiconductor chip attachment element; and at least one member that electrically connects the semiconductor chip with the interconnects; wherein the semiconductor chip is bonded to the semiconductor chip attachment element by an adhesive and at least a portion of at least one member that electrically connects the semiconductor chip with at least one interconnect is sealed or imbedded with a sealant/filling agent, and the complex modulus of at least one of the adhesive and the sealant/filling agent is not greater than 1 x 10<8> Pa at -65 DEG C and a shear frequency of 10 Hz. The semiconductor device according to the present invention is characterized by an excellent resistance to thermal shock. <IMAGE> |