| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0236
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0239
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0245 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
| filingDate |
1991-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2001-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2001-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-3181623-B2 |
| titleOfInvention |
Polymer base material which is catalytic to copper adhesion, epoxy glass laminate for manufacturing printed wiring boards and method for manufacturing printed wiring boards |
| priorityDate |
1990-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |