| abstract |
An object of the present invention is to improve temperature uniformity by suppressing temperature unevenness of a wafer and to prevent arcing from occurring with a plasma gas. An electrostatic chuck includes a ceramic plate capable of adsorbing a wafer, a metal cooling plate bonded to one side of the plate via a first insulating resin layer, a plate, 1 A plurality of through holes 24 penetrating the insulating resin layer 18 and the cooling plate 20, and a cooling plate penetrating portion of the through hole 24 penetrating the cooling plate 20 is inserted, and an outer peripheral surface thereof is an inner peripheral surface of the cooling plate penetrating portion. And an insulating tube 26 bonded through a second insulating resin layer 28. The diameter φx of the first insulating resin layer penetrating portion of the through hole 24 is formed to be equal to or larger than the diameter φy of the plate penetrating portion and smaller than the diameter φz of the cooling plate penetrating portion. Among these, a first insulating resin layer 18 is interposed between the end surface on the plate side and the plate 12. [Selection] Figure 3 |