http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-3102026-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 1990-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2000-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2000-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-3102026-B2 |
| titleOfInvention | Epoxy resin molding compound for electronic parts encapsulation |
| priorityDate | 1990-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.