http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-3098375-B2
Outgoing Links
Predicate | Object |
---|---|
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
filingDate | 1994-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2000-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2000-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-3098375-B2 |
titleOfInvention | Phenol resin and its manufacturing method, epoxy resin molding material for sealing electronic parts, and IC package |
priorityDate | 1994-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 83.