Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0133 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29299 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0781 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0132 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-20 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
filingDate |
1997-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2000-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2000-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-3052074-B2 |
titleOfInvention |
Burn-in test substrate for integrated circuit chip and method for manufacturing know good die using the same |
abstract |
Disclosed is a substrate used in performing a burn-in test of the integrated circuit chip prior to packaging the chip and a method for manufacturing a known good die using the same. The substrate includes a body having a plurality of through holes; a plurality of metal lines formed on one surface of the body and electrically connected to a plurality of bonding pads of the integrated circuit chip; and a plurality of pins each inserted into the respective corresponding holes and electrically connected to the respective corresponding metal lines and also projected from a surface opposite to the surface on which the metal lines of the substrate are formed. Moreover, the method of manufacturing a known good die includes performing a burn-in test in a state in which the integrated circuit chip is adhered to the substrate such that the bonding pads of integrated circuit chip are electrically connected to the metal lines of the substrate. After the performance of the burn-in test, the integrated circuit chip is separated from the substrate. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101582118-B1 |
priorityDate |
1996-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |