http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-3021336-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-285 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-04 |
| filingDate | 1995-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2000-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2000-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-3021336-B2 |
| titleOfInvention | Method for forming wiring layer of semiconductor device |
| priorityDate | 1994-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.