http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2964823-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate | 1993-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1999-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1999-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2964823-B2 |
| titleOfInvention | Adhesive film, manufacturing method thereof, adhesion method, support member with adhesive film, and semiconductor device |
| abstract | PURPOSE:To prepare an adhesive film for die bonding which, like a conventional silver paste, enables the heat treatment in die bonding to be carried out at a relatively low temp. CONSTITUTION:This adhesive film contains 100 pts.wt. polyimide resin obtd. by reacting a diamine with a tetracarboxylic dianhydride component contg. at least 70mol% tetracarboxylic dianhydride of the formula (wherein (n) is an integer of 2-20), 1-200 pts.wt. epoxy resin, 0.02-240 pts.wt. phenol resin, 0.0001-100 pts.wt. cure accelerator, and 50-4,000 pts.wt. inorg. filler. |
| priorityDate | 1993-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 146.