http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2877168-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 1991-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1999-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1999-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2877168-B2 |
| titleOfInvention | Method of manufacturing bump electrode for integrated circuit device |
| priorityDate | 1991-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID62687 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452260893 |
Total number of triples: 12.