http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2836166-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-01 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 |
| filingDate | 1990-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1998-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1998-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2836166-B2 |
| titleOfInvention | Chip carrier |
| abstract | PURPOSE:To make the formation of the lead of an IC easier and, at the same time, to improve the reliability of the IC, by forming a spacer on a surface facing the circuit-side surface of the IC of silicon rubber coated with a silicon resin for alpha-ray radiation. CONSTITUTION:A spacer 10 firmly stuck to a substrate 1 with a bonding agent 11 is formed of silicon rubber and constituted so that the spacer 10 can hold an IC 6 on the substrate 1. The spacer 10 is coated with the same silicon resin 12 for shielding alpha-rays as that covering the circuit-side surface 7 of the IC 6, with the resin 12 hardened. Since the spacer 10 can be set to a prescribed thickness, the clearance between the IC 6 and substrate 1 can be set to a uniform size and, at the same time, since it is unnecessary to apply and harden the silicon resin to and on the IC 6, the IC 6 is not heated to high temperature when the resin 12 is applied to the spacer 10. Moreover, since alpha rays emitted from the substrate 1, leads 8, and spacer 10 can be stopped by means of the resin 12 applied to the spacer 10, occurrence of soft errors can be prevented. Therefore, the lead of the IC can be formed easily and the reliability of the IC can be improved. |
| priorityDate | 1990-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.