http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2770433-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 1989-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1998-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1998-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2770433-B2 |
| titleOfInvention | Method for forming metal wiring structure of semiconductor device |
| priorityDate | 1989-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.